WhatsApp:+852-69577225| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
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42-6552-11CONN IC DIP SOCKET ZIF 42POS GLD |
3,262 | $30.16 |
RFQ |
Datasheet |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
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42-3554-11CONN IC DIP SOCKET ZIF 42POS GLD |
3,995 | $30.16 |
RFQ |
Datasheet |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
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42-6554-11CONN IC DIP SOCKET ZIF 42POS GLD |
2,191 | $30.16 |
RFQ |
Datasheet |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
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110-13-640-61-801000CONN IC SKT DBL |
2,968 | $30.18 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
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510-91-156-15-061002SOCKET SOLDERTAIL 156-PGA |
2,269 | $30.21 |
RFQ |
Bulk | 510 | Active | PGA | 156 (15 x 15) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
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510-91-156-15-061001SKT PGA SOLDRTL |
2,442 | $30.21 |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 156 (15 x 15) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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510-91-156-15-061003SKT PGA SOLDRTL |
3,400 | $30.21 |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 156 (15 x 15) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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117-43-764-61-105000CONN IC SKT DBL |
3,677 | $30.23 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
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117-43-664-61-105000CONN IC SKT DBL |
2,184 | $30.23 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
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24-3570-16CONN IC DIP SOCKET ZIF 24POS |
3,890 | $30.26 |
RFQ |
Datasheet |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyphenylene Sulfide (PPS), Glass Filled |
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24-3571-16CONN IC DIP SOCKET ZIF 24POS |
2,899 | $30.26 |
RFQ |
Datasheet |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyphenylene Sulfide (PPS), Glass Filled |
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24-3572-16CONN IC DIP SOCKET ZIF 24POS |
2,825 | $30.26 |
RFQ |
Datasheet |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyphenylene Sulfide (PPS), Glass Filled |
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510-93-120-13-061001SOCKET SOLDERTAIL 120-PGA |
3,426 | $30.32 |
RFQ |
Tube | 510 | Active | PGA | 120 (13 x 13) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
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510-93-120-13-061002SKT PGA SOLDRTL |
2,656 | $30.32 |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 120 (13 x 13) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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510-93-120-13-061003SKT PGA SOLDRTL |
3,000 | $30.32 |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 120 (13 x 13) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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32-6508-212CONN IC DIP SOCKET 32POS GOLD |
3,034 | $30.33 |
RFQ |
Datasheet |
Bulk | 508 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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32-6508-312CONN IC DIP SOCKET 32POS GOLD |
2,169 | $30.33 |
RFQ |
Datasheet |
Bulk | 508 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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510-43-120-13-061001SKT PGA SOLDRTL |
3,743 | $30.33 |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 120 (13 x 13) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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38-3503-21CONN IC DIP SOCKET 38POS GOLD |
2,207 | $30.38 |
RFQ |
Datasheet |
Bulk | 503 | Active | DIP, 0.3 (7.62mm) Row Spacing | 38 (2 x 19) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
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38-3503-31CONN IC DIP SOCKET 38POS GOLD |
3,807 | $30.38 |
RFQ |
Datasheet |
Bulk | 503 | Active | DIP, 0.3 (7.62mm) Row Spacing | 38 (2 x 19) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
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