Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
517-87-401-19-101111

517-87-401-19-101111

CONN SOCKET PGA 401POS GOLD

Preci-Dip

2,350 $16.41

RFQ

517-87-401-19-101111

Datasheet

Bulk 517 Active PGA 401 (19 x 19) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-13-320-41-801000

123-13-320-41-801000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

2,931 $17.26

RFQ

123-13-320-41-801000

Datasheet

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
28-6556-11

28-6556-11

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3,605 $17.26

RFQ

28-6556-11

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
36-3503-20

36-3503-20

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

3,233 $17.26

RFQ

36-3503-20

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
36-3503-30

36-3503-30

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

3,348 $17.26

RFQ

36-3503-30

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
21-0503-21

21-0503-21

CONN SOCKET SIP 21POS GOLD

Aries Electronics

3,042 $17.26

RFQ

21-0503-21

Datasheet

Bulk 0503 Active SIP 21 (1 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
21-0503-31

21-0503-31

CONN SOCKET SIP 21POS GOLD

Aries Electronics

3,165 $17.26

RFQ

21-0503-31

Datasheet

Bulk 0503 Active SIP 21 (1 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
24-81000-310C

24-81000-310C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,700 $17.26

RFQ

24-81000-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-81250-310C

24-81250-310C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,003 $17.26

RFQ

24-81250-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-8240-310C

24-8240-310C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3,916 $17.26

RFQ

24-8240-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-8300-310C

24-8300-310C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3,570 $17.26

RFQ

24-8300-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-8312-310C

24-8312-310C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,101 $17.26

RFQ

24-8312-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-8385-310C

24-8385-310C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3,795 $17.26

RFQ

24-8385-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-8500-310C

24-8500-310C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,674 $17.26

RFQ

24-8500-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-8600-310C

24-8600-310C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3,986 $17.26

RFQ

24-8600-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-8770-310C

24-8770-310C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3,908 $17.26

RFQ

24-8770-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-8844-310C

24-8844-310C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3,582 $17.26

RFQ

24-8844-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-8900-310C

24-8900-310C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,187 $17.26

RFQ

24-8900-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
APA-324-G-P

APA-324-G-P

ADAPTER PLUG

Samtec Inc.

2,187 $17.27

RFQ

Tube APA Active - 24 (2 x 12) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
APA-624-G-P

APA-624-G-P

ADAPTER PLUG

Samtec Inc.

2,375 $17.27

RFQ

Tube APA Active - 24 (2 x 12) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
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